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NGL-SLT-2000 Green Laser Diamond Cutting Machine
NGL-SLT-2000 Green Laser Diamond Cutting Machine
NGL-SLT-2000 Green Laser Diamond Cutting Machine
NGL-SLT-2000 Green Laser Diamond Cutting Machine
NGL-SLT-2000 Green Laser Diamond Cutting Machine
NGL-SLT-2000 Green Laser Diamond Cutting Machine

NGL-SLT-2000 Green Laser Diamond Cutting Machine

Description

NGL-SLT-2000 Green Laser Diamond Cutting Machine

High-Speed, High-Precision Solution for Diamond and Ultra-Hard Materials

The NGL-SLT-2000 is a high-performance laser cutting system designed specifically for ultra-hard materials such as natural diamonds, CVD/HPHT synthetic diamonds, PCD, PDC, silicon carbide, and carbon-based composites. Equipped with a proprietary 532nm green laser and integrated CNC motion control modules, this system delivers exceptional precision, speed, and long-term operational stability.

Key Features

  • Proprietary 532nm Green Laser Source: In-house developed, ensuring minimal attenuation and consistent beam quality.

  • Precision CNC Motion Platform: Japanese-imported linear motor system with ±0.005mm repeatability.

  • Closed Optical Path & Robust Construction: Fully enclosed cutting chamber with anti-vibration granite base and steel-welded structure.

  • CCD Vision System: 130W industrial camera with 25x magnification for precise positioning and real-time monitoring.

  • User-Friendly Software Interface: Custom-developed smart control software with task automation and clear UI.

  • Dual Grinding Heads: Fast switching via 180° rotation for efficiency.

Key Advantages

  • Stable Long-Term Operation: Water-cooled laser source and efficient heat dissipation ensure high durability.

  • Unmatched Cutting Accuracy: Nanosecond pulse width and <1.3 m² beam quality ensure ultra-clean cuts.

  • Automation Ready: Supports multi-piece cutting programs with minimal manual input.

  • Enhanced Operator Safety & Cleanliness: Fully sealed system with dust management and integrated cooling.

  • Customizability: Software and functions can be tailored to your application needs.

Technical Specifications

Laser System Parameters

  • Laser Source: In-house pump laser (integrated terminal type)

  • Laser Power: 20W

  • Wavelength: 532nm

  • Mode: TEM₀₀

  • Beam Quality (M²): ≤1.3

  • Pulse Energy: ≥2MJ @ 10kHz

  • Repetition Rate: 5–20kHz

  • Pulse Width: <20ns

  • Cooling: Water-cooled

  • Max Cutting Depth: 20mm

  • Working Temperature: 20–50°C

Machine Specifications

  • Ambient Temp / Humidity: <25°C / <70%

  • Machine Size: 1264×864×1585mm

  • Total Power: 2KW

  • Air Pressure: 86–106KPa

  • Voltage: AC220V

  • Weight: 600KG

CNC Motion System

  • Axes Travel (X/Y/Z): 150×150×60mm

  • Repeatability: ±0.005mm

  • Guide Rail: Japanese imported

CCD Vision System

  • Camera: 130W industrial-grade, 1280×1024ppi, 300FPS

  • Zoom: 25x

  • Power / Lighting: 24V / Bar light

Cooling System

  • Power: 1200W

  • Temp Range: 20–30°C

  • Water Capacity: 18L

Machine Frame

  • Structure: Steel-welded

  • Base Platform: Granite

  • Finish: Gray-white powder coat

Application Scope

  • Cutting natural diamonds, CVD/HPHT synthetic diamonds
  • Processing PCD/PDC tools and silicon carbide wafers
  • Precision micromachining of graphene and carbon fiber components
  • High-performance finishing of ultra-hard materials for jewelry, semiconductors, and industrial tools

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