NGL-SLT-2000 Green Laser Diamond Cutting Machine
Description
NGL-SLT-2000 Green Laser Diamond Cutting Machine
High-Speed, High-Precision Solution for Diamond and Ultra-Hard Materials
The NGL-SLT-2000 is a high-performance laser cutting system designed specifically for ultra-hard materials such as natural diamonds, CVD/HPHT synthetic diamonds, PCD, PDC, silicon carbide, and carbon-based composites. Equipped with a proprietary 532nm green laser and integrated CNC motion control modules, this system delivers exceptional precision, speed, and long-term operational stability.
Key Features
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Key Advantages
Stable Long-Term Operation: Water-cooled laser source and efficient heat dissipation ensure high durability.
Unmatched Cutting Accuracy: Nanosecond pulse width and <1.3 m² beam quality ensure ultra-clean cuts.
Automation Ready: Supports multi-piece cutting programs with minimal manual input.
Enhanced Operator Safety & Cleanliness: Fully sealed system with dust management and integrated cooling.
Customizability: Software and functions can be tailored to your application needs.
Technical Specifications
Laser System Parameters
Laser Source: In-house pump laser (integrated terminal type)
Laser Power: 20W
Wavelength: 532nm
Mode: TEM₀₀
Beam Quality (M²): ≤1.3
Pulse Energy: ≥2MJ @ 10kHz
Repetition Rate: 5–20kHz
Pulse Width: <20ns
Cooling: Water-cooled
Max Cutting Depth: 20mm
Working Temperature: 20–50°C
Machine Specifications
Ambient Temp / Humidity: <25°C / <70%
Machine Size: 1264×864×1585mm
Total Power: 2KW
Air Pressure: 86–106KPa
Voltage: AC220V
Weight: 600KG
CNC Motion System
Axes Travel (X/Y/Z): 150×150×60mm
Repeatability: ±0.005mm
Guide Rail: Japanese imported
CCD Vision System
Camera: 130W industrial-grade, 1280×1024ppi, 300FPS
Zoom: 25x
Power / Lighting: 24V / Bar light
Cooling System
Power: 1200W
Temp Range: 20–30°C
Water Capacity: 18L
Machine Frame
Structure: Steel-welded
Base Platform: Granite
Finish: Gray-white powder coat
Application Scope
- Cutting natural diamonds, CVD/HPHT synthetic diamonds
- Processing PCD/PDC tools and silicon carbide wafers
- Precision micromachining of graphene and carbon fiber components
- High-performance finishing of ultra-hard materials for jewelry, semiconductors, and industrial tools