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150W Ceramic Laser Cutting Drilling And Marking Machine
Products introduction
Ceramic laser cutting drilling and marking machine
Ceramic laser cutting drilling and marking machine
- Adopt marble precision platform, XY separated closed structure, with good rigidity, shock resistance and high-speed stability;
- Adopt magnetic suspension linear motor, high-precision guide rail and 0.1um high-precision grating ruler full closed-loop feedback system, fast speed, high precision and low maintenance rate;
- Adopt special fiber laser and precision special cutting head to ensure small cutting seam, high precision, smooth cutting surface without burrs;
- Built-in power supply regulator, safe protection of equipment and electrical appliances, stable and reliable;
- CCD automatic visual positioning function can be configured as needed, which can accurately identify various mark points;
- Self-developed cutting software, easy to learn and use, customers can choose customized functions.
Application: Mainly used for laser cutting, drilling and marking of advanced ceramics such as alumina AL2O3, zirconium oxide ZrO2, aluminum nitride ALN, silicon nitride SI3N4, etc.
Products Parameters
QCW high precision fiber laser source
BOCHU high precision laser CNC system
| No. | Item | Parameter |
| 1 | Laser wavelength | 1060-1080nm |
| 2 | Laser power | 150W (power optional) |
| 3 | Cutting format | 350*350mm |
| 4 | X/Y axis repeat positioning accuracy | ±3um |
| 5 | Processing speed | 0-5000mm/min |
| 6 | Maximum moving speed | 50m/min |
| 7 | Processing thickness | ≤2mm (depending on the material) |
| 8 | Processing accuracy | ±0.01-0.02mm |
| 9 | Transmission mode | Linear motor + 0.1um grating ruler |
| 10 | Machine power (excluding fan) | ≦5KW |
| 11 | Total weight of the machine | About 1500KG |
| 12 | Appearance size | 1500*1400*1800mm(Subject to the actual product) |
Products Application
1. Industrial products: various industrial ceramic accessories and molds;
2. PCB industry: cutting, punching and marking of ceramic circuit boards;
3. 3C industry: various ceramic substrates, mobile phone ceramic back panels, middle frames, wearable digital products, etc.;
4. New energy industry: solar photovoltaic equipment, automotive sensors, hydrogen fuel cells and other ceramic devices.
Silicon nitride micro-hole drilling
Ceramic electronic device processing
Ceramic thick film circuit cutting and drilling
Ceramic gear processing
