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DMK 1000W High-Power Ceramic Laser Cutting & Drilling Machine
Product Description
The 1000W High-Power Ceramic Laser Cutting & Drilling Machine is designed for high-precision processing of advanced ceramics. Equipped with a state-of-the-art custom fiber laser, this system delivers outstanding beam quality, compact design, and high photoelectric conversion efficiency. With minimal maintenance, low operating costs, and energy-saving performance, it is the ideal choice for precision cutting and drilling in demanding industries.
Product Parameters
| Specification | Details |
|---|---|
| Laser Wavelength | 1060–1080 nm |
| Laser Power | QCW-1000W |
| Working Area | 600 × 600 mm |
| Repeat Positioning Accuracy | ±5 μm |
| Processing Speed | 0–500 mm/s |
| Max Travel Speed | 60 m/min |
| Cutting Thickness | ≤ 8 mm (material-dependent) |
| Processing Accuracy | ±0.02–0.03 mm |
| Drive System | Imported linear motor + 0.5 μm grating scale |
| Power Consumption (excluding fan) | ≤ 8 kW |
| Total Weight | Approx. 1800 kg |
| Machine Dimensions | 1800 × 1470 × 1890 mm (subject to actual product) |
Other Details
Key Features
High Stability Structure
Built with a precision marble platform and integrated gantry-style enclosed structure for excellent rigidity, vibration resistance, and high-speed stability.
Precision Motion System
Uses imported magnetic levitation linear motors, high-precision guides, and a fully closed-loop feedback system with 0.5μm optical gratings for exceptional accuracy and speed.
Specialized Laser Configuration
Features a custom fiber laser and precision ceramic cutting head to ensure narrow kerf width, clean edges, and burr-free cuts.
Reliable Power Management
Includes a built-in voltage stabilizer to protect electronic components, ensuring safe and stable operation.
Optional CCD Vision System
Supports automatic mark point recognition for highly accurate positioning and cutting.
Sample Display
Applications
This advanced laser system is optimized for cutting and drilling a wide range of ceramic materials, including:
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Alumina (Al₂O₃)
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Zirconia (ZrO₂)
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Aluminum Nitride (AlN)
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Silicon Nitride (Si₃N₄)
With optional CCD visual positioning, it also supports:
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Mark point recognition
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Scribing and cutting of metallized ceramics and chip substrates
It is widely used in:
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Medical devices
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Aerospace and military components
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Precision components in high-end manufacturing
Industry Applications
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Industrial Ceramics: Molds and structural components
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PCB Industry: Cutting, drilling, and scribing of copper/aluminum-based boards and ceramic circuit boards
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New Energy: Solar photovoltaic modules, automotive sensors, hydrogen fuel cell ceramics
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3C Industry: Mobile phone ceramic backplates, middle frames, fingerprint sensor covers, heating elements for e-cigarettes
Company Information
